Strain/Stress and Vibration

3D ESPI System (Q-300)

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Strain and Stress Measurement

  • Full field, 3-dimensional measurement without contact and marking
  • Delivers Youngs-Modulus and Poisson Ratio
  • Measurement of any material, also of unisotropic material

The 3D ESPI System Q-300 enables complete three dimensional and highly sensitive deformation and strain analysis of any component.

The measurement is performed without contact and on the whole measuring field. No marking is required on the measure object. With its unprecedented compactness, the system's sensor head offers convenient portability and flexible set-up for any material measurement task.

The Q-300 is best suited for the development and testing of complex components and structures in electronics, , and . It is ideal for the experimental verification of analytical and numerical calculation techniques.

The fully portable Q-300 is symmetrically designed, with interchangeable laser illumination arms to maintain different illumination base lengths and sensitivities。

Therefore, it can be operated in the 1D-, 2D- or 3D-mode without loss of accuracy. The built-in zoom lens enables adaptation to different object sizes and geometries. With macro lenses, very small areas can be analyzed as well.

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Strain distribution on knitted fabrics Stress distribution at laser welding seam Stress concentration at fracture mechanics Biomedicine: 3D-deformation and strain at teeth

The sensor is driven by a ruggedized electronic control system with the complete software package ISTRA for Windows It offers automatic, or manual measurement, and quantitative data analysis of 3D-displacement and strain fields.

Maximum measuring accuracy is guaranteed by taking into account the varying sensitivity with different object coordinates. Therefore, the complete geometry matrix is recalculated automatically by ISTRA for Windows® for every object point.


Technical Data

Measuring Sensitivity: 0.03 - 1 µm adjustable
Measuring Range: Adjustable to any measurement range by variation of measurement steps
(10 - 100 μm per step depending on measuring direction) 
Measuring area: up to 200 x 300 mm2 (8"x12") larger areas with external laser
Operation modes: automatic, manual, 1D, 2D, 3D operation
Data interface TIFF, ASCII, Windows metafile>
Data acquisition speed: 3.5 seconds for 3D analysis
Data analysis: automatic serial analysis or manual at any loading step
Base length of illumination: min. 120 mm (4.7")
Dimensions of sensor head (without arms): 80 x 80 x 120 mm3 (3.1" x 3.1" x 4.7")
Weight: 2.5 kg (5.5 lbs) (total sensor)
Laser (built-in): diode, 2 x 75 mW, 785nm
Processor: Pentium PC
Operating system: Windows 2000, XP
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